1. Overview of Equipment and Application Fields

The Horizontal Vacuum Plasma Cleaner is a large-capacity surface treatment system designed for large-scale industrial production and high-throughput pilot testing. Unlike traditional vertical compact equipment, this model features a horizontal chamber structure with ample internal space, supporting batch loading of multi-layer trays or large fixtures, significantly increasing the number of samples processed per session and production efficiency. Utilizing radio frequency (RF) glow discharge technology, the device generates high-energy plasma from process gases under vacuum conditions to perform ultra-fine cleaning, deep activation, micro-etching, and graft modification on material surfaces.

This equipment effectively addresses the pain points of traditional wet cleaning methods, including low efficiency, difficult waste liquid treatment, high drying costs, and inability to process complex 3D structures. Its dry environmental protection process not only complies with stringent EHS standards but also thoroughly cleans blind holes, crevices, and micro-rough surfaces, ensuring highly uniform and consistent treatment results. The horizontal vacuum plasma cleaner is widely used in industries with high demands for production capacity and stability, serving as a key device that enables seamless transition from laboratory R&D to industrial mass production.

Widespread application areas:

· Semiconductors and integrated circuits: wafer batch cleaning, lead frame deoxidation, pre-packaging surface activation, and large-scale PCB adhesive removal.

· Photovoltaic industry: pre-plating cleaning of solar cells, pre-treatment for backsheet bonding, and surface modification of module frames.

· Biomedical: Large-scale hydrophilization treatment and sterilization cleaning of medical devices such as catheters, stents, and syringes.

· Automotive electronics and components: sensor cleaning, wire harness terminal activation, pre-treatment for rubber seal bonding, and pre-modification for lamp housing coating.

· Consumer electronics: Large-scale surface cleaning and adhesion enhancement for phone casings, buttons, screen modules, and connectors.

· New energy battery: Lithium battery electrode, separator, shell of batch oil removal and surface wetting improvement.

2. Core Functional Highlights

Design of Horizontal Large Cavity and Batch Loading

o Extra-large processing capacity: The horizontal chamber design provides a massive effective volume, capable of accommodating large workpieces or multi-tier pallet racks. The single-processing capacity is several to dozens of times higher than that of similar vertical equipment, significantly reducing the cost per unit.

o Flexible loading method: Equipped with standard multi-layer stainless steel pallet racks or customized tooling fixtures, supporting mixed loading of workpieces of different sizes and shapes. The airflow distribution design has been optimized to ensure uniform plasma density across all positions within the chamber, guaranteeing consistency in batch processing.

o Efficient material handling: The hatch features a wide-side or top-opening design (per model), with pneumatic or electric lifting mechanisms for quick loading/unloading of heavy fixtures or large batches, boosting production line throughput.

High Performance RF Plasma Source

o Stable RF excitation: Equipped with industrial-grade 40kHz or 13.56MHz RF power supply, offering adjustable output power in a wide range (e.g., 0-1000W or higher, depending on configuration). Capable of generating high-density, long-lasting uniform plasma fields under low atmospheric pressure.

o Automatic matching network: Equipped with a high-precision auto-matcher that monitors load impedance changes in real time and responds with millisecond-level precision. This ensures optimal RF energy coupling to the cavity while maintaining ultra-stable process conditions, making it ideal for extended continuous operation.

o Multi-process mode: Supports pure physical bombardment (Ar gas), pure chemical reaction (O₂/H₂ gas), and mixed gas mode, enabling customized optimal cleaning strategies for different pollutant types (grease, oxides, photoresist, etc.).

Precise Vacuum and Multi-channel Airflow Control System

o High-speed vacuum unit: Equipped with a high-power mechanical vacuum pump (or optionally a Roots pump), it delivers rapid pumping to achieve working vacuum levels (typically <10Pa) in large-volume chambers, effectively reducing downtime.

o Digital vacuum monitoring: Equipped with a high-precision capacitive film gauge, it provides real-time accurate display of chamber pressure with an accuracy of ±1%, ensuring traceability of process parameters.

o Multi-channel Mass Flow Control (MFC): Supports 2-4 or more mass flow meters for precise control of process gases including oxygen, argon, hydrogen, and carbon tetrachloride (with SCCM-level accuracy). Features automatic gas mixing ratio adjustment to meet complex process requirements.

intelligent automatic control

o PLC Central Control: Featuring industrial-grade PLC controllers with a large-size color touchscreen HMI, it displays key parameters including operational status, vacuum level, power, flow rate, and temperature in graphical format.

o Formula Management System: Supports storing over 100 process formulas with permission management capabilities. Users can initiate preset programs with a single click to achieve fully automated operation from vacuum extraction, gas charging, ignition, processing to exhaust, eliminating manual intervention.

o Data Recording and Traceability: The system automatically records batch-specific process parameter curves and alarm information, supporting USB export or network upload, in compliance with ISO quality system requirements for production data traceability.

Security, Durability, and Scalability

o Robust structural design: The chamber is fabricated from high-grade stainless steel (SUS304/316) through welding, precision polishing and anodizing processes, ensuring corrosion resistance, easy cleaning, and suitability for harsh industrial environments.

o Multiple safety protections: The system is equipped with interlock access control, overcurrent and overheating protection, vacuum level anomaly protection, gas leakage detection, and emergency stop buttons. In any abnormal state, the system immediately cuts off high voltage and triggers an alarm.

o Modular scalability: Featuring dedicated exhaust treatment, real-time monitoring, and automated loading/unloading interfaces, it seamlessly integrates into fully automated production lines.

3. Technical Parameters and Specifications

4. Detailed Explanation of Typical Application Scenarios

Semiconductor packaging production line:

o Batch cleaning of lead frames: Process thousands of lead frames at once, completely removing stamping oil and oxidation layers, and improving the gold wire bonding yield to over 99.9%.

o Wafer Detergents: Simultaneously process multiple wafer boxes in a large-capacity chamber, efficiently removing photoresist residues without generating chemical waste liquids.

Photovoltaic module manufacturing:

o Backsheet bonding treatment: The solar backsheet undergoes large-area plasma activation, significantly enhancing adhesion strength with the frame adhesive to ensure the module remains laminated throughout its 25-year outdoor service life.

o Cell cleaning: removes cutting fluid residues and dust from silicon wafers, improving coating uniformity and cell conversion efficiency.

Large-scale production of medical devices:

o Catheter hydrophilization: A single treatment reduces the contact angle of hundreds of medical catheters to below 10°, minimizing insertion pain and enhancing patient comfort.

o Implant cleaning: Perform thorough cleaning and sterilization of orthopedic implants and cardiac stents to remove processing residues, thereby promoting bone integration and cell growth.

Automotive parts manufacturing:

o Lighting fixture bonding: This process bonds the PC/PMMA lamp cover to the base, replacing primer to achieve high-strength sealing and prevent fog penetration.

o Sensor cleaning: Batch cleaning of automotive radar and pressure sensor chips to remove flux and fingerprints, ensuring stable signal transmission.

Consumer electronics assembly:

o Pre-treatment for phone shell painting: Perform full-line cleaning and activation of metal or plastic shells to enhance paint adhesion and prevent peeling defects.

o Waterproof and breathable film application: Activates the waterproof film surface on the phone's earpiece and speaker to enhance adhesive strength, thereby improving the reliability of the IP68 waterproof rating.

5. Why choose a horizontal vacuum plasma cleaner?

The horizontal vacuum plasma cleaner achieves perfect balance between production capacity and quality. Its unique horizontal large-chamber design breaks through the throughput bottleneck of traditional equipment, meeting the demands of industrial-scale continuous production while significantly reducing per-unit processing costs. The high-performance RF power supply and automatic matching system ensure extreme process stability and high repeatability, guaranteeing consistent high standards for every batch. Multi-channel precision airflow control and intelligent PLC system provide flexible handling of complex processes, whether for cleaning, activation, or etching. As a green, environmentally friendly dry cleaning technology with zero waste liquid, it not only helps enterprises easily comply with increasingly stringent environmental regulations but also enhances market competitiveness by improving product yield and performance. Choosing the horizontal vacuum plasma cleaner means embracing the future of efficient mass production, enabling you to stand out in fierce market competition with dual advantages in technology and cost.